When choosing materials for high-temperature resistant USB camera modules, optical performance, heat resistance and mechanical strength should be taken into account. The following are common materials and their characteristics:
Lens material: High-temperature resistant cameras often use all-glass lenses. Glass material has a high melting point and a low coefficient of thermal expansion, making it less likely to deform in high-temperature environments and ensuring the stability of optical performance. Some lenses will also undergo coating treatment to enhance the transparency of light, reduce light loss, and ensure the clarity and accuracy of the image.
Shell material: Some high-temperature resistant camera modules use heat-resistant tempered glass as the shell material. This material contains heat-resistant boric acid and silicic acid components, which can withstand the temperature difference changes of cold and heat, have a small coefficient of thermal expansion, and are not easy to break even under sudden temperature changes. It has a series of excellent properties such as low expansion, thermal shock resistance, high temperature resistance, corrosion resistance, and high strength. In addition, some camera modules are made of modified plastics, such as infrared PC material, which is modified from polycarbonate (PC) with special color powder additives. It has a relatively high heat distortion temperature and can maintain stable performance without softening or deforming in high-temperature environments.
Internal circuit board and chip packaging materials: Internal circuit boards typically use PCB materials, while chip packaging offers various options, such as COB packaging (chip surface mount technology), BGA packaging (ball grid array packaging), QFN packaging (pin-less packaging), SIP packaging (monolithic integrated packaging), and CSP packaging (chip-level packaging), etc. These packaging technologies each have their own characteristics, but they are all dedicated to enhancing the heat resistance, reliability and integration of chips. For instance, CSP packaging features high density and high reliability, making it suitable for camera modules with high requirements for high-temperature resistance.